The process in which polyolefin and polyamide materials are primarily used was designed to environmentally protect and encapsulate electronic components such as circuit boards. They were made to defend the pieces from vibration, dirt, dust, and moisture. This procedure was also used to strain reliefs, mold grommets, and seal connectors.
Factors that include special equipment for shaping and raw supplies are the primarily completes the composition of this procedure. The low pressure molding methods uses dimer acid or polyamide based supplies to shape numerous compounds. This process was called as the innovative production procedure that requires the incorporation of potting or molding injections where hot melt adhesives placed in low pressures are injected.
This method is considered as cheaper alternative to epoxy potting which insures the protection of various fragile elements. When applied in connector and cable shaping, they can offer excellent strain relief when compared to customary plastic injection. They are capable of offering complete seals for the components to insure their water tight encapsulation, and are effective for strain reliefs.
The low viscosity property is accountable for injecting the supplies at low pressures in which the wires and components are stirred away from harm and dislocation. Easy encapsulation of the delicate pieces is achieved to protect them from harmful fumes from the supplies and processing. The traditional method is incorporated with the basics of shaping their cases, and palletizes subsequently follows.
The insertion of the electronic components and preheating them follows subsequently. After the preheating procedure, they are encapsulated, settled, and vacuumed, and testing and curing them comes last. The low pressure method flow is completed by inserting the pieces followed by their over molding, and testing them comes after.
The complete idea affiliated with a shaping method states that are qualified to replace a housing and potting process in a single application. This procedure tells you that you should a large PC board with the utilization of an external connector before you place them in a case. The individual encapsulation method of a component is to be performed before the conventional ones.
Over molding various figures is also advised which is followed by the packaging of sensitive and high performance elements. Shaping grommets and tension reliefs, sealing multi wire connectors, and shaping them with strain relief are the primary steps of attaining excellent strain relief. Furthermore, they are followed by the procedure which involves sealing of micro switches.
This procedure is created by Henkel Corporation which was located in Europe, and experiments about the usage of hot melt supplies to primarily seal connectors or create tension relief for numerous wires was conducted. But, the automotive industry was responsible for their commercial release. They were concerned on replacing toxic and oppressive potting methods with lighter and safer ones.
Ever since then, this method has been applied in various areas such as wire harness, military, consumer, medical, industrial products, and other items that require sealing processes, and the protection against the environment. Likewise, they could also be applied in various outputs such as control boards, moisture sensors, RFID tags, and USB thumb drive. Simply, if sealing methods and protection is needed, this process is the excellent solution.
Factors that include special equipment for shaping and raw supplies are the primarily completes the composition of this procedure. The low pressure molding methods uses dimer acid or polyamide based supplies to shape numerous compounds. This process was called as the innovative production procedure that requires the incorporation of potting or molding injections where hot melt adhesives placed in low pressures are injected.
This method is considered as cheaper alternative to epoxy potting which insures the protection of various fragile elements. When applied in connector and cable shaping, they can offer excellent strain relief when compared to customary plastic injection. They are capable of offering complete seals for the components to insure their water tight encapsulation, and are effective for strain reliefs.
The low viscosity property is accountable for injecting the supplies at low pressures in which the wires and components are stirred away from harm and dislocation. Easy encapsulation of the delicate pieces is achieved to protect them from harmful fumes from the supplies and processing. The traditional method is incorporated with the basics of shaping their cases, and palletizes subsequently follows.
The insertion of the electronic components and preheating them follows subsequently. After the preheating procedure, they are encapsulated, settled, and vacuumed, and testing and curing them comes last. The low pressure method flow is completed by inserting the pieces followed by their over molding, and testing them comes after.
The complete idea affiliated with a shaping method states that are qualified to replace a housing and potting process in a single application. This procedure tells you that you should a large PC board with the utilization of an external connector before you place them in a case. The individual encapsulation method of a component is to be performed before the conventional ones.
Over molding various figures is also advised which is followed by the packaging of sensitive and high performance elements. Shaping grommets and tension reliefs, sealing multi wire connectors, and shaping them with strain relief are the primary steps of attaining excellent strain relief. Furthermore, they are followed by the procedure which involves sealing of micro switches.
This procedure is created by Henkel Corporation which was located in Europe, and experiments about the usage of hot melt supplies to primarily seal connectors or create tension relief for numerous wires was conducted. But, the automotive industry was responsible for their commercial release. They were concerned on replacing toxic and oppressive potting methods with lighter and safer ones.
Ever since then, this method has been applied in various areas such as wire harness, military, consumer, medical, industrial products, and other items that require sealing processes, and the protection against the environment. Likewise, they could also be applied in various outputs such as control boards, moisture sensors, RFID tags, and USB thumb drive. Simply, if sealing methods and protection is needed, this process is the excellent solution.
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